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Contact

Beijing: 
Add: Room 7008, Jiyou Building, #2 Changximen Road, Haidian District, Beijing, China. 
Tel: 86-10-88447108;88440938 
Fax: 86-10-88438081 

Shanghai: 
Add: Room 1208, Jiaxing Building, #877 Dongfang Road,Pudong District, Shanghai City, China
Tel: 86-21-61005198；61005196
Fax: 86-21-61005197 

Shenzhen: 
Add: Room1431,Intemational Culture Building,#3039 Shennan Zhong Road,Futian District, Shenzhen, China 
Tel: 86-755-83640909 
Fax:86-83663361 

A. TPT Manual Wire Bonder & Manual Die Bonder

1. HB05 Manual Wire Bonder
2. HB10 Wedge & Ball Bonder
3. HB16 Wedge & Ball Bonder
4. HB30 Heavy Wire Bonder
5. HB100 Wedge & Ball Bonder
6. HB75 Manual Die Bonder

B. DAGE Bondtester & X-RAY System of UK

1. DAGE Bondtester

(1) DAGE STELLAR 4000 Bondtester
(2) DAGE4000 PLUS Bondtester
(3) DAGE4000HS High Speed Bondtester
(4) DAGE4000 Optima Bondtester  
(5) DAGE3800 Bondtester
(6) DAGE 4000W Wafer Handling System
(7) DAGE 4800 Bondtester

2. DAGE X-RAY System of UK

(1) DAGE XD7500VR XiDAT Inspection System
(2) DAGE Quadra™ 3 X-ray Inspection Systems
(3) DAGE Quadra™ 5 X-ray Inspection Systems
(4) DAGE Quadra™ 7 X-ray Inspection Systems  
(5) DAGE 7600 3D X-RAY Inspection
(6) DAGE XD7800-For Larger Boards X-ray System
(7) DAGE XM8000 Wafer X-ray Metrology Platform

C. SONOSCAN Sound Technology With Vision

1. Sonoscan D9650™ C-SAM:The Modern Standard for Acoustic Microscopes
2. Sonoscan Gen7™ C-Mode Scanning Acoustic Microscope
3. Sonoscan Fastline™ P300™ C-SAM Maximum Throughput, Minimal Footprint
4. Sonoscan AW™ Series C-SAM Operator-Free Wafer Inspection, Analysis and Sorting

D. TESCAN Scanning electron microscopy

1. TESCAN VEGA Scanning electron microscopy
2. TESCAN MIRA High-resolution Scanning electron microscopy
3. TESCAN CLARA Scanning electron microscopy
4. TESCAN MAGNA Scanning electron microscopy
5. TESCAN AMBER FIB-SEM systems
6. TESCAN SOLARIS FIB-SEM systems
7. TESCAN AMBER X FIB-SEM systems
8. TESCAN SOLARIS X FIB-SEM systems
9. TESCAN TENSOR 4D-STEM systems
10. TESCAN micro-CT systems

E. SURAGUS Thin Film Characterization

1. EddyCus® TF lab 2020
2. EddyCus® TF map 2530
3. EddyCus® TF inline

F. PALOMAR Wire Bonder and Die Bonder

1. 3880 Die Bonder
2. 6500 Die Bonder
3. 8000i Wire Bonder
4. 9000 Wedge Bonder
G. RKD Automated Dual Acid Decapsulator & Laser decapsulation
1. RKD Automated Dual Acid Decapsulator
2. RKD Laser decapsulation
H. FAI Photo Emmission Microscope      
1. FAI Photo Emmission Microscope

I. Matrix Automated X-ray inspection system

1. MatriX X2 Automated in-line x-ray inspection system
2. MatriX X3 Automated X-ray inspection system
3. MatriX X2# Automated X-ray inspection system
4. MatriX X2.5# automated X-ray inspection system

J. Nordson AOI Automated Optical Inspection & Metrology System

1. SQ3000 DD 3D AOI Automated Optical Inspection
2. SQ3000 Multi Function AOI, SPI & CMM Automated Optical Inspection
3. SQ3000+ Multi Function AOI, SPI & CMM Automated Optical Inspection
4. WX3000 3D & 2D Metrology and Inspection System
K. Rehm Reflow Condensation Soldering      
1. Condenso Reflow Condensation Soldering
L. ULTRA TEC LAPPING AND POLISHING SYSTEMS  
1. ASAP-1 Backside Preparation & Mechanical Decapsulation
2. ULTRAPOL Advance Lapping and Polishing Machine

M. YESTECH AOI Automated Optical Inspection Systems

    
1. M1m Series AOI Automated Optical Inspection Systems

N. Acculogic flying probe testers & In-Circuit Testers

1. Acculogic FLS980 flying probe testers
2. Acculogic In-Circuit Testers
3. Acculogic Test Programming Services
4. Acculogic Boundary Scan
O. BF Can & Ceramic Opener    
1. BF1100 Can Opener
2. BF2100 Ceramic Package Opener

P. Other Consumables And Spare Parts

1. Hooks,Shears,Filament,Fluid & Tools For Polishing,Arc-lite Fluid ......     ↑Back to top
 

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