BE FIRST TECHNOLOGY CO., LTD. is a main first-class Micro-Electronics、SMT、LCD 、LED、OPTO-Electronics、MEMS、BIO-Electronics...manufacturing equipments、test instruments、R&D tools、consumables、service supplier in China. it has excellent & experienced sales / service teams in each area, after more than 10 years running, has set with up closely and strongly relations with many world famous manufactures and customers.
The company’s mission is: "Supply the first-class products to the customers; Supply the first-class service to the customers; Set up and keep the first-class relations with the cooperators".
We believe: With the Chinese Electronics market developing we will get “Double Win” by the good cooperation between us.
The Nordson DAGE4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull tester or upgraded for ball shear, die shear, bump pull, vectored-pull, or tweezer pull tests.
DAGE Quadra™ Series X-ray inspection takes you beyond optical imaging. Proprietary QuadraNT sealed X-ray tube technology allows you to non-destructively inspect obscured areas inside devices and components at up to 68,000 times magnification.
SONOSCAN acoustic microscope
The D9600™ C-Mode Scanning Acoustic Microscopeis part of the new generation in Acoustic Microscopy Imaging (AMI) innovation. Whether your needs are for failure analysis, process development, material characterization, low-volume production or other lab inspections,the D9600 delivers unmatched capabilities.
TPT Manual Wire Bonder
The TPT Manual Wire Bonder is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and small scale production lines One Bond Head for bonding in Ball/Wedge or Wedge / Wedge bonding mode. Only tool change necessary. Easy operation with TFT Touch Screen, direct access and simple adjustment of all bond parameters.