Condenso Reflow Condensation Soldering


 

  

 

Simply. More. Technique.

In fact, Condenso from Rehm Thermal Systems is a state-of-the-art condensation reflow soldering solution. Addressing the complex demands of lead-free solder alloys for PCBs with a large thermal mass, Condenso will solder your most difficult PCBs quickly, void free and reliably for maximum return on investment.

System advantages

Low operating costs
Profile longitudinal / lateral ±2 K
Ideal for PCBs with large thermal mass
Void-free thanks to vacuum option
Simple, accurate temperature profiling
Horizontal conveyor
Constant temperature
Inert gas soldering

Specifications:

Model        L * W * H
XM       3100*2030*1770 mm
XP       4100*2030*1770 mm
XPHS     4100*2030*1770 mm

 

 

       
Flat soldering (1cm2)        Flat soldering (1cm2)
without vacuum  
         with vacuum

   

Blogroll:Befirst Baidu Google Alibaba HC360 SEMI

 
 
 
 

About us|Site map|Product halls|contact us

Copyright © Be First Technology Co.,Ltd 京ICP 06010381

中文|English