OPLAS Automatic machine of adhesive wrapping

 

 



 

OPLAS fulfills the functions of three machines:
Oxalate dispensing, pick and place and laser sintering.

OPLAS is optimized for the production of small series with innovating processes of electronic components transfer.

• Assembly of power modules at low temperature (160-180°C) and low pressure with state-of-the-art thermal conductivity
• Sintering thanks to crystallization of metallic nanomaterials created during the process completion
• Concentration on a sole machine of oxalate dispensing, component transfer and sintering
• Integrated high accuracy dispensing system
• Automatic process completion by detection of phase changes
• Dynamic servo control of process parameters: temperature, pressure, position
• Initial and final materials with micrometric size -> noconstraint due to nanoparticles regulation
• Optimized sintering quality : no void > 50μm, compatible with spatial applications
• Assembly under vacuum or inert gas
• Overheating localized on sintering area, protecting the component from overheating
• Process traceability and analysis for parameter optimization

Oxalate Precursors Laser Sintering Station

OXALATE DISPENSING SYSTEM

An automatic dispensing system allows the dispensing of an oxalate layer with an adjustable thickness from 50μm to 300μm with an accuracy of 5μm

LASER

As basic version OPLAS includes a continuous laser heat input YAG of 600W. This power allows the lead frame to reach a temperature of 250°C within 2s. The spot size is configurable from diameter 4 to 16mm with a « Top Hat » energy distribution. The temperature is homogeneous on the subordinate face of component. The overheating power is piloted throughout the process.

MONITORING

• Programming: The Man‐Machine‐Interface (MMI) allows the operator to select the program to be used during his manufacturing campaign. Beforehand programs are created on a user‐friendly interface in the form of steps. These steps define the component sintering/soldering process.

• Process tracking: During the process cycle, displacements and force are displayed in real time on MMI. The operator can keep track of the process and check that the transfer cycle complies with scheduled sequences.

• Analysis and post‐treatment: Parameters and data are saved for post treatment analysis of events that occurred during process cycle. This analysis allows process improvement and the combination of laser with electromagnetic head operation.

ASSEMBLY PROCESSES

OPLAS can integrate additional functions such as:
• automatic positioning assisted by camera,
• work area inerting by vacuum or inert gas,
• component rotation
• Automatic change of laser spot size…

MACHINE TECHNICAL DATA

Laser: YAG 600W continuous / integrated cooling unit (air cooling)
Electrical consumption: 5kVA
Electromagnetic head: Sintering force: up to 200N, travel resolution: 0.1μm
Electromagnetic head arm: 3 servo axes, interpolated: X,Y,Z
X,Y axes: linear motors and precision measuring
Z axis: ball screw / motor / Brushless brake absolute encoder
Axes positioning repeatability : ± 1μm
Laser head: Beam type « Top Hat », 3 interchangeable head optics (3x3/8x8/16x16)
Laser head arm: X,Y Axes: linear motors and precision measuring
Machine size: 1400mm x 1200mm x 2000mm
Machine weight: 1 ton

 

   

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