HB05 Wedge & Ball Bonder
Manual Wire Bonder

 

 

 

  

 

+ Wedge, BaU, Bump and Ribbon bonding
+ 17p to 75|j Wire and 25|j x 250(j Ribbon
+ 4,3” TFT Display & Multi Button
+ Deep-Access Bond Head 16mm
+ Bond Arm Length 165mm
+ Motorized Tail Control
+ 20 Program Storage Capacities
+ Electronic BaU Size Control

HB05 Thermosonic Wire Bonder for Wedge & Ball Bonding
The HB05 is a Bench Top Size Wire Bonder, ideal for laboratories and pilot production lines.
One Bond Head for bonding in Ball/Wedge or Wedge/Wedge bonding mode. Only tool change necessary. Easy operation with TFT Display, direct access and simple adjustment of all bond parameters.

Technical Specifications

Bonding Methode Wedge-Wedge, Ball-Wedge, Ribbon- & Bumb- bonding
Gold wire diameter 17-75u (0,7-3 mil)
Aluminium wire diameter 17-75u (0,7-3 mil)
Ribbon size max. 25 x 250u (1x 8 mil)
Ultrasonic system 62 kHz Transducer PLL Control
Utrasonic power 0-5 Watt Output
Bond time 0 - 1 sec.
Bond force 5-130 cNm
Bonding tool 1,58 ø 19 mm length (0,0624” x 0,750")
Motorised Wire Spool 50,8 mm ( 2")
Wire termination Bond Head Tear
Wire feed angle 90°
Clamp movement Motorized, Up / Down
Ball size control Electronic
Throat depth 165 mm ( 6,7")
Fine Table motion 10 mm ( 0,4")
Mouse ratio 6:1
Temperature controller up to 250°C +/- 1°C
Electrical Requirements 100 - 240V +/-10% 50/60 Hz 10A max.
Physical Dimensions 550 x 450 x 250mm
Weight Net 25 kg
Industry Standards CE standards


 

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