7900 Series Dicing Saws

 

 

 

 

 



 

Cope with your Production Challenges

The growing market and the ongoing demand to lower the cost of production per unit (CoO) drived ADT to launch the 7900 series.

The main advantages of the 7900 series:

• Simplicity
• Automation
• Ease of use
• New generation of graphic user interface (GUI)
• Small foot print systems

7900 Uno (model 7910)

Configuration

• Spindle: 2”
• Size: 200mm

Features & Benefits

• Single spindle
• Low cost-of-ownership
• Small footprint and compact (short height)
• High reliability
• Easy to use, intuitive, touch screen based GUI
• Easy to maintain
• High accuracy (enhanced by advanced error mapping correction)
• Advanced vision automation
• Comprehensive, optimized dicing cycle
• Yield enhancement and cost saving capabilities
• Kerf inspection and quality analysis
• Blade wear monitoring and projection
• Spindle load monitoring
• Process data logging and statistical analysis
• Compatible with ADT 7900 Twin Spindle Dicing System

Optional Capabilities

• Advanced continuous magnification vision system
• Broken blade detector
• Integrated dressing station
• Variety of porous ceramic chucks (4”,5”, 6” and 8”)
• High power spindle
• Bar code reader
• Dicing Floor Management system (DFM)

Leading Applications

• LED packages and wafers
• Discrete device wafers
• Power device wafers
• Glass wafers

The Ultimate Dicer for

• Universities and research institutes
• IC back-end plants (for 2”-8” wafer dicing production lines)
• LED beginners (for process development, pilot production, R&D)

7900 Duo (model 7900)

Configurations

• Spindle: 2”
• Size: 150mm or 200mm

Features & Benefits

• Two facing spindles
• Low cost-of-ownership
• Small footprint
• High accuracy, high throughput, high productivity
• Advanced vision automation
• Comprehensive, optimized dicing cycle
• High reliability and maintainability
• Easy to use, intuitive, touch screen based GUI
• Yield enhancement and cost saving capabilities
• Kerf inspection and quality analysis
• Blade wear monitoring and projection
• Spindle load monitoring
• Process data logging and statistical analysis
• Workpiece distortions compensation
• Multi-panel handling
• Blade dressing

Optional Capabilities

• Partial wafer recognition
• Tape surface detection
• Advanced continuous magnification vision system
• Off-chuck dressing station
• Dicing floor management system (DFM)
• Special configurations
• Variety of chucks
• High power spindle

Leading Applications

• LED wafers
• LED packages
• Discrete device wafers
• Imaging sensors and lenses

 

   

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